Instrukcja obsługi Digi SM-500MK4

Digi Inny SM-500MK4

Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Digi SM-500MK4 (95 stron) w kategorii Inny. Ta instrukcja była pomocna dla 23 osób i została oceniona przez 12 użytkowników na średnio 3.6 gwiazdek

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SERVICE MANUAL

DIGITAL COMPUTING PRINTING SCALE

SM-500MK4

Edition 1

Table of Content

i) Notice 1

ii) Safety Information ..............................................................................................................................2

1. GENERAL ....................................................................................................................................................3

1.1 Model Specification ............................................................................................................................3

1.2 Operating Specification......................................................................................................................4

1.3 Type of Interface ................................................................................................................................4

1.4 Main Components ..............................................................................................................................4

2. OVERVIEW ..................................................................................................................................................5

2.1 Dimension ..........................................................................................................................................5

2.1.1 Pole ......................................................................................................................................5

2.1.2 Touch Screen Pole...............................................................................................................5

2.1.3 Bench ...................................................................................................................................6

2.2 Key sheet Layout ...............................................................................................................................7

2.3 Panel Layout ....................................................................................................................................10

3. SPAN SWITCH ..........................................................................................................................................11

3.1 Span Switch Jumper Setting Changing Procedure..........................................................................11

3.2 Span Switch located in Main Board..................................................................................................11

4. INITIAL SETUP ..........................................................................................................................................12

4.1 Scale Assembly ................................................................................................................................12

4.1.1 Display Pole Kit Mounting ...................................................................................................12

4.1.2 Level Adjustment ................................................................................................................12

4.2 Software Setting ...............................................................................................................................12

4.2.1 Memory Initialization ...........................................................................................................12

4.3 Calibration ........................................................................................................................................16

4.4 User Spec Setup Procedure.............................................................................................................17

4.5 Weigh & Measurement Spec Setup Procedure ..............................................................................19

5. HARDWARE TESTING & MAINTENANCE ..............................................................................................21

5.1 Hardware Testing.............................................................................................................................21

5.1.1 RAM Read and Write Test ..................................................................................................21

5.1.2 SIO Loop Back Test............................................................................................................22

5.1.3 RS485 Loop Back Test .......................................................................................................22

5.1.4 Ethernet Loop Back Test ....................................................................................................22

5.1.5 ROM Checksum Test..........................................................................................................23

5.1.6 PLU Generator Test............................................................................................................23

5.1.7 Internal Count......................................................................................................................24

5.1.8 Span Switch Status.............................................................................................................25

5.2 Adjustment........................................................................................................................................25

5.2.1 Location of Gap Sensor And Peel Sensor. .........................................................................25

5.2.2 Label Gap Sensor ...............................................................................................................25

5.2.3 Peel Sensor.........................................................................................................................26

5.2.4 Printing Position ..................................................................................................................27

5.3 Maintenance.....................................................................................................................................28

5.3.1 Thermal Head Cleaning ......................................................................................................28

5.3.2 Basic Maintenance.............................................................................................................29

5.3.3 Thermal Head cleaning and replacement ..........................................................................30

5.4 Method of Assembly Sealing Screw & Sticker .................................................................................31

6. DISASSEMBLY..........................................................................................................................................33

6.1 Pole Type Disassembly....................................................................................................................33

6.2 AD Board Disassembly ....................................................................................................................36

6.3 Loadcell Disassembly ......................................................................................................................37

6.4 Extra Bracket Disassembly for 30Kg................................................................................................38

7. FIRMWARE UPGRADE .............................................................................................................................39

7.1 Boot loader Downloading.................................................................................................................39

7.2 Firmware Downloading ....................................................................................................................42

8. HARDWARE SETTING..............................................................................................................................46

8.1 Main Board Jumper Setting..............................................................................................................46

9. MISCELLANEOUS ....................................................................................................................................46

9.1 Error Messages ................................................................................................................................46

9.2 Corresponding Key of IBM Keyboard...............................................................................................48

9.3 ASCII Characters..............................................................................................................................48

9.4 TERAOKA Code...............................................................................................................................49

9.5 Wire And Connector .........................................................................................................................49

9.5.1 Straight & Crossover Ethernet Cable.................................................................................49

9.5.2 Cash Drawer Option (RJ11)...............................................................................................50

9.5.3 PS2 Keyboard Option ........................................................................................................51

9.5.4 RS232C and Multi-Drop (4 Line, RS485) Wire ..................................................................51

10. APPENDIX .................................................................................................................................................55

10.1 Block Diagram..................................................................................................................................55

10.1.1 Bench Type.........................................................................................................................55

10.1.2 Touch Screen Pole Type ....................................................................................................56

10.1.3 Elevated Type .....................................................................................................................57

10.2 Specification List.............................................................................................................................58

10.2.1 User Specification [REZERO] + [1][4][1] ............................................................................58

10.2.2 Weigh & Measure Specification [REZERO] + [1][4][2].......................................................83

10.2.3 Weigh & Measure Specification [REZERO] + [1][4][1] (For SM90TS, SM500TS and

SM500MK4TS)...................................................................................................................91

11. REVISION RECORDS ...............................................................................................................................92