Instrukcja obsługi HP ProLiant DL160 Gen10

HP serwer ProLiant DL160 Gen10

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HPE ProLiant DL160 Gen10 Server User

Guide

Part Number: 878591-002

Published: February 2019

Edition: 2

Abstract

This document is for the person who installs, administers, and troubleshoots servers and

storage systems. Hewlett Packard Enterprise assumes you are qualified in the servicing of

computer equipment and trained in recognizing hazards in products with hazardous energy

levels.

Notices

The information contained herein is subject to change without notice. The only warranties for Hewlett

Packard Enterprise products and services are set forth in the express warranty statements accompanying

such products and services. Nothing herein should be construed as constituting an additional warranty.

Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained

herein.

Confidential computer software. Valid license from Hewlett Packard Enterprise required for possession,

use, or copying. Consistent with FAR 12.211 and 12.212, Commercial Computer Software, Computer

Software Documentation, and Technical Data for Commercial Items are licensed to the U.S. Government

under vendor's standard commercial license.

Links to third-party websites take you outside the Hewlett Packard Enterprise website. Hewlett Packard

Enterprise has no control over and is not responsible for information outside the Hewlett Packard

Enterprise website.

Acknowledgments

microSD is a trademark or a registered trademark of SD-3D in the United States, other countries of both.

Microsoft®, Windows®, and Windows Server® are either registered trademarks or trademarks of Microsoft

Corporation in the United States and/or other countries.

Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

Red Hat®

Enterprise Linux is a registered trademark of Red Hat, Inc. in the United States and other

countries.

VMware®

ESXi™ and VMware vSphere® are registered trademarks or trademarks of VMware, Inc. in the

United States and/or other jurisdictions.

Contents

Important product information.............................................................. 7

Component identification.......................................................................8

Front panel components............................................................................................................... 8

Four-bay LFF drive model..................................................................................................8

Eight-bay SFF drive model with optical drive..................................................................... 8

Eight-bay SFF drive model with two-bay SFF drive backplane option............................... 9

Front panel LEDs and buttons...................................................................................................... 9

Four-bay LFF drive model..................................................................................................9

Eight-bay SFF model........................................................................................................11

Power fault LEDs..............................................................................................................12

Rear panel components..............................................................................................................13

Rear panel LEDs.........................................................................................................................14

PCIe expansion slot definitions...................................................................................................15

PCIe slot description................................................................................................................... 15

System board components......................................................................................................... 17

System maintenance switch descriptions........................................................................ 18

Processor, heatsink, and socket components..................................................................19

Drive bay numbering...................................................................................................................20

Four-bay LFF drive model................................................................................................20

Slim SSD numbering (Four-bay LFF drive model only)................................................... 20

Eight-bay SFF drive model with optical drive................................................................... 20

Eight-bay SFF drive model with two-bay SFF drive backplane option.............................21

Drive LEDs and buttons.............................................................................................................. 21

Low profile LFF drive LED definitions.............................................................................. 21

Hot-plug drive LED definitions..........................................................................................22

NVMe SSD LED definitions..............................................................................................23

NVMe SSD button actions............................................................................................... 24

Fan locations...............................................................................................................................25

Setup...................................................................................................... 26

Optional service.......................................................................................................................... 26

Initial server installation...............................................................................................................26

HPE Installation Service...................................................................................................26

Setting up the server........................................................................................................ 27

Operational requirements........................................................................................................... 30

Space and airflow requirements.......................................................................................30

Temperature requirements............................................................................................... 30

Power requirements......................................................................................................... 31

Electrical grounding requirements....................................................................................31

Server warnings and cautions.....................................................................................................32

Rack warnings.............................................................................................................................32

Electrostatic discharge................................................................................................................33

Installing the server into the rack................................................................................................ 33

POST screen options..................................................................................................................34

Operating system........................................................................................................................34

Installing the operating system with Intelligent Provisioning............................................ 35

Installing or deploying an operating system..................................................................... 35

Specyfikacje produktu

Marka:	HP
Kategoria:	serwer
Model:	ProLiant DL160 Gen10
Wysokość produktu:	42.926 mm
Szerokość produktu:	434.594 mm
Głębokość produktu:	614.934 mm
Ilość portów Ethernet LAN (RJ-45):	2
Taktowanie procesora:	1.7 GHz
Typ procesora:	Intel® Xeon®
Model procesora:	3106
Kod zharmonizowanego systemu (HS):	84714100
Przewodowa sieć LAN:	Tak
Usługa RAID:	Tak
Producent procesora:	Intel
Liczba rdzeni procesora:	8
Typ pamięci wewnętrznej:	DDR4-SDRAM
Pamięć wewnętrzna:	16 GB
Ilość portów USB 3.2 Gen 1 (3.1 Gen 1) Typu-A:	3
Obudowa:	Rack (1U)
Zainstalowany system operacyjny:	Nie
Maksymalna pojemność pamięci:	256 GB
Gniazdo procesora:	LGA 3647 (Socket P)
Poziomy raid:	0, 1,5
Zasilanie:	500 W
Liczba obsługiwanych HDD:	4
Rodzaj interfejsu sieci Ethernet:	Gigabit Ethernet
Liczba portów VGA (D-Sub):	1
System operacyjny:	Microsoft Windows Server\nRed Hat Enterprise Linux (RHEL)\nSUSE Linux Enterprise Server (SLES)\nOracle Solaris\nVMware
Korekcja ECC:	Tak
Gniazda pamięci:	16x DIMM
Rozmiar HDD:	- "
Całkowita pojemność przechowywania:	0 GB
Obsługiwane rozmiary dysków twardych:	3.5 "
Procesor ARK ID:	123540
Technologia Intel® Hyper Threading (Intel® HT Technology):	Nie
Technologia Intel® Turbo Boost:	Nie
Nowe instrukcje AES (Intel® AES-NI):	Tak
Technologia Udoskonalona Intel SpeedStep:	Tak
Technologia Intel® Trusted Execution:	Tak
Intel® VT-x with Extended Page Tables (EPT):	Tak
Intel® TSX-NI:	Tak
Intel® 64:	Tak
Technologia Wirtualizacji Intel® (Directed I/O) (VT-d):	Tak
Technologia virtualizacji Intel® (VT-x):	Tak
Wersja Intel® TSX-NI:	1.00
Maksymalna pojemność przchowywania:	8 TB
Liczba procesorów:	1
Typ pamięci procesora:	L3
Cache procesora:	11 MB
Wskaźnik magistrali systemowej:	- GT/s
Litografia procesora:	14 nm
Liczba wątków:	8
Tryb pracy procesora:	64-bit
Nazwa kodowa procesora:	Skylake
Maksymalna pamięć wewnętrzna wspierana przez procesor:	768 GB
Typy pamięci wspierane przez procesor:	DDR4-SDRAM
Taktowanie zegara pamięci wspierane przez procesor:	2133 MHz
Maksymalna liczba linii PCI Express:	48
Termiczny układ zasilania (TDP):	85 W
Bezkonfliktowy procesor:	Tak
Stepping:	U0
Kod procesora:	SR3GL
Technologia Execute Disable Bit (EDB):	Tak
Skalowalność:	2S
Wbudowane opcje dostępne:	Tak
Wielkość opakowania procesora:	76.0 x 56.5 mm
Układ pamięci:	1 x 8 GB
Prędkość zegara pamięci:	2400 MHz
Obsługa zasilania zapasowego (RPS):	Nie
Liczba głównych źródeł zasilania:	1
Gniazda PCI Express x8 (Gen 3.x):	3
Wersja gniazd typu Slot (PCI Express):	3.0
Tcase:	77 °C
Generowanie procesora:	Intel® Xeon® Scalable
Napędy optyczne:	Nie