Instrukcja obsługi Intel S5520UR
                    Intel
                    
                    płyta główna
                    
                    S5520UR
                
                                
    Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Intel S5520UR (1 stron) w kategorii płyta główna. Ta instrukcja była pomocna dla 11 osób i została oceniona przez 6 użytkowników na średnio 4.5 gwiazdek
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E
RMM3
Connector
D
RMM3 Module
A
Intel is a registered trademark of Intel Corporation or its 
subsidiaries in the United States and other countries.  
* Other names and brands may be claimed as the property 
of others.  Copyright © 2008-2009, Intel Corporation. 
All rights reserved.
Warning
 Read all caution and safety 
  statements in this document 
  before performing any of the 
instructions.  Also see the Intel
®
Server Board and Server Chassis 
Safety Information document at:
http://support.intel.com/support/
motherboards/server/sb/cs-010770
.htm for complete safety information.
Warning
  Installation and service of 
  this product should only be
  performed by qualified service 
personnel to avoid risk of injury from 
electrical shock or energy hazard.
Tools Required
Caution
  Observe normal ESD
  [Electrostatic Discharge]
  procedures during system 
integration to avoid possible 
damage to server board and/or 
other components.
        Anti-static
wrist strap
     Phillips*
screwdriver
Intel® Server System SR1600UR
Quick Start User's Guide
If you are not familiar with ESD (Electrostatic Discharge) procedures 
used during system integration, please see the Intel® Server System 
SR1600UR Service Guide, available on the Intel ® Server Deployment
Toolkit 3.0 CD or at 
http://support.intel.com/support/motherboards/server/s5520ur/.
Read all cautions and warnings first before starting your server system integration.
Thank you for buying an Intel ® Server System.  
The following information will help you assemble 
your Intel® Server System SR1600UR (both hot-swap 
and fixed drive systems) and install components. 
This guide and other supporting documents 
are located on the web at 
http://support.intel.com/support/motherboards/server/s5520ur/.
Please boot to the Intel® Server Deployment Toolkit 3.0 
CD first for BIOS and firmware configuration and updates.
E52175-003
1
Preparing
the 
Chassis
Observe normal ESD 
(Electrostatic Discharge) 
procedures.
Place your 
Intel® Server 
Chassis on a flat anti-static 
surface to perform the 
following integration 
procedures. Observe ESD 
procedures before 
reaching inside to make 
server board connections 
or install components.
3
Remove Add-in 
Card Riser Assembly
To remove the riser:
Grasp the riser assembly with both
hands and lift straight up.
          CAUTION:
Place the riser 
assembly 
upside down to 
avoid damage 
to the riser card 
connector.
Riser Card
Connector
2
Remove the 
Top Cover
B
Remove the security screw.
Depress the latch.
CSlide cover back 
and lift upward.
A
C
BA
Minimum Hardware Requirements
To avoid integration difficulties and 
possible board damage, your system must 
meet the following minimum requirements:
• Memory Type:  Minimum of one 
  512-MB, 240-pin DDR3 
  800/1066/1333-MT/s DIMMs.
•   IntelProcessor: ® Xeon® processor 
  5500 series with 2 MB cache support.
• Hard Disk Drives:
  SATA/SAS
• Rack Mount Kit 
   (EIA 310-D compliant)
For a complete list of compatible 
processors and memory, see
http://support.intel.com/support/
motherboards/server/s5520ur/ 
Hot-Swap Drive System
Fixed Drive System
6
Install the Processor(s) F.   Close Load Plate and 
    Socket Lever
D.   Remove the 
    Processor 
    Protective Cover
Take the processor 
out of the box and 
remove the 
protective shipping 
cover.
A
A
C.   Remove the Socket 
    Protective Cover
Save the protective cover 
for future use.
Grasp the socket protective cover 
by the two tabs and carefully lift 
straight up.
A
To avoid damage, DO NOT 
DROP the cover onto the 
socket wires or components.
Orient the processor with the 
socket such that the orientation 
notches on the processor align 
with the two orientation posts 
on the socket.
A
Install the processor as shown.
Close the load 
plate all the 
way as 
shown.
Close the socket lever and 
ensure that the load plate tab 
engages under the socket 
lever when fully closed.
B
A
B
A
A
Orientation Notch
Orientation Post
E.  Install the Processor
  CAUTION:
  The underside of the 
processor has components 
that may damage the socket 
wires if installed improperly.
Components
Processor must align 
correctly with the socket 
opening before installation.
DO NOT DROP processor 
into the 
socket!
A.  Open the Socket 
    Lever
Push the lever handle 
down and away from 
the socket to 
release it.
Rotate the lever open 
all the way.
B.   Open the Load Plate
Push the rear tab with your 
finger tip to bring the front 
end of the load plate 
up slightly.
Open the load plate 
as shown.
A
B
A
B
A
B
Read all Cautions before proceeding.
When unpacking a processor, hold 
by the edges only to avoid touching 
the gold contact wires.
NOTE: If you are only using one processor 
on your server board, install the processor 
on the CPU socket labeled ‘CPU 1’ on the 
server board.
When opening a socket, DO NOT 
TOUCH the gold socket wires.
B
A
10
Install Intel® Remote Management Module 3 (optional)
Attach the module bracket to the 
chassis with two screws as shown.
Note that screws install from the 
back of the chassis.
Attach the RMM3 module bracket to the RMM3 module with two screws as shown.
Connect one end of the cable (labeled 'RMM3') to the RMM3 connector on the RMM3 module.  Note that cable
connectors are keyed and can only go in one way.
Connect the opposite end of the cable (labeled 'server board') to the RMM3 connector on the server board.
B
Squeeze the sides of the RMM3 filler panel to disengage it from the server system back panel and remove it.
A
C
D
E
E
RMM3
Connector
D
RMM3 Module
A
B
Top View
C
Bottom
9
Install I/O Expansion Module (optional)
Squeeze the sides of the filler panel(s) to disengage it from the server system back panel 
and remove it.  Note:  If you are installing an I/O expansion module that uses only one slot, 
remove the filler panel only from the slot shown so that the module can be attached to I/O 
Connector 1; do not remove the filler panel from the other slot.
Install the standoffs to the server 
board by pressing into the 
holes as shown.
Note:  For the 1-socket 
module, install three 
standoffs as shown in 
gray.  For the 2-socket 
module, also install 
the fourth standoff as 
shown in red.
Position the module over
the server board, fit the 
front of the module into the 
back panel slot(s), and 
then attach the module to 
the server board connector 
and engage the standoffs.
A
B
C
1-Socket
I/O Exp. Module
Standoff
Hole
2-Socket
I/O Exp. Module
I/O Connector 1
A
B
Filler Panels
C
Fourth
Standoff
Position
I/O Connector 2
Snap
Standoff
8
Install Memory DIMMs
To Install DIMMs:
Memory Configurations and Population Order:
Note:  For additional memory configurations, see the Service Guide 
on the Intel® Server Deployment Toolkit 3.0 CD that accompanied 
your Intel®
 Server System SR1600UR, or go to:  
http://support.intel.com/support/motherboards/server/s5520ur/ 
Memory sizing and configuration is supported only for qualified 
DIMMs approved by Intel. For a list of supported memory, use the 
Server Configurator Tool available at:  
http://serverconfigurator.intel.com/default.aspx
For best performance, a minimum of three DIMMs per CPU is recommended.  
In a single-processor configuration, always populate A1 DIMM first.  In a 
dual-processor configuration, always populate A1 DIMM first for CPU 1 and D1 DIMM 
first for CPU2.  In order to maintain adequate thermal levels, DIMMs or DIMM 
blanks must be installed in the DIMM slots as per the following requirements:
•  If you have only one processor installed, all CPU 1 DIMM slots 
  must either have a DIMM or DIMM blank installed.  You may 
  either leave the CPU 2 DIMM slots empty or store extra 
  blanks in the blue DIMM slots.
•  If you have both processors installed, all blue DIMM slots in 
  CPU 1 and CPU 2 must either have a DIMM or a DIMM blank 
  installed.  You may store extra DIMM blanks in any of the 
  unused CPU 1 DIMM slots.
Open both DIMM socket levers.
Push down firmly on the DIMM until it
snaps into place and both levers close.
Insert DIMM making sure the connector edge 
of the DIMM aligns correctly with the slot.
C
A
D
IMPORTANT!  Visually check that each
latch is fully closed and correctly
engaged with each DIMM edge slot.
E
Note location of alignment notch.
B
CAUTION:  Avoid touching contacts 
when handling or installing DIMMs.
A
C
D
B
E
DIMM A2
DIMM A1
DIMM C1
DIMM C2
DIMM B1
DIMM B2
Chan A
Chan B
Chan C
CPU Socket 1
DIMM F1
DIMM F2
DIMM D2
DIMM D1
DIMM E2
DIMM E1
Chan F
Chan E
Chan D
CPU Socket 2
7
Install the Heatsink(s)
TIM
Each heatsink has four captive fasteners and should be tightened in a 
diagonal manner using the following procedure:
Note:  Heatsink styles may vary.
Remove the protective film on the TIM if present.
  Using a #2 Phillips* screwdriver, start with screw 1 and engage screw
          threads by giving it two rotations and stop.   (Do not fully tighten.) 
  Repeat steps C and D by giving each screw two rotations each time 
  until each screw is lightly tightened up to a maximum of 
  8 inch-lbs torque.
  Proceed to screw 2 and engage screw threads by giving it two 
  rotations and stop. Similarly, engage screws 3 and 4. 
D
  CAUTION: The heatsink has thermal interface 
  material (TIM) on the underside of it.  Use caution so 
      that you do not damage the thermal interface material.  
  Use gloves to avoid sharp edges.
E
C
A
Align   to the front and back of the chassis heatsink fins
for correct airflow. Airflow goes from front-to-back 
of chassis.
B
IMPORTANT NOTE:
This Intel® Server Chassis requires passive heatsinks.
2
3
1
4
CAUTION:
Do not 
over-tighten
fasteners.
Air Flow
Chassis Front
IMPORTANT!
Before proceeding 
further, check your Intel ® 
Server System for 
disconnected or loose 
cables and components 
that may have occurred 
during 
shipping.
4
Remove Air Baffle and
Processor Air Duct
B
Remove the 
air baffle.
Remove the 
processor
air duct.
A
Processor
Air Duct
Air Baffle
A
B
5
Remove the Heatsink(s)
The heatsink is attached to the server board /
processor socket with captive fasteners.
Using a #2 Phillips* screwdriver, loosen the four 
screws located on the heatsink corners in a 
diagonal manner using the following procedure:
Lift the heatsink straight up.
A
D
TIM
Remove the
Spacer
This Side Up
Discard to Install CPU
IMPORTANT:  This spacer must be
removed and discarded before
opening the socket to install the
processor in Step 6.
This Side Up
Discard to Install CPU
  CAUTION: The heatsink has thermal interface 
  material (TIM) on the underside of it.  Use caution so 
      that you do not damage the thermal interface material.  
  Use gloves to avoid sharp edges.
  Using a #2 Phillips* screwdriver, start with 
  screw 1 and loosen it by giving it two rotations 
  and stop. (IMPORTANT: Do not fully loosen.) 
  Repeat steps A and B by giving each screw 
  two rotations each time until all screws are 
  loosened.
  Proceed to screw 2 and loosen it by giving it two 
  rotations and stop. Similarly, loosen screws 3 
  and 4. 
B
C
A
D
Specyfikacje produktu
| Marka: | Intel | 
| Kategoria: | płyta główna | 
| Model: | S5520UR | 
| Typ produktu: | Server/Workstation Board | 
| Szerokość produktu: | 305 mm | 
| Głębokość produktu: | 330 mm | 
| Ilość portów USB: | 5 | 
| Przeznaczenie: | PC | 
| Ilość portów Ethernet LAN (RJ-45): | 2 | 
| Układ: | SSI TEB-leveraged (12 x 13) | 
| Kod zharmonizowanego systemu (HS): | 8473301180 | 
| Liczba portów USB 2.0: | 4 | 
| Przewodowa sieć LAN: | Tak | 
| Producent procesora: | Intel | 
| Obudowa: | Stojak | 
| Obsługiwane rodzaje pamięci: | DDR3-SDRAM | 
| Obsługiwane prędkości zegara pamięci: | 1066 MHz | 
| Maksymalna pojemność pamięci: | 192.38 GB | 
| Obsługa kanałów pamięci: | Hexa-kanał | 
| Gniazdo procesora: | LGA 1366 (Socket B) | 
| Rodzaj płyty: | SSI TEB | 
| Układ płyty głównej: | Intel® 5520 | 
| Poziomy raid: | 0, 1 | 
| PCI Express x16 gniazda: | 1 | 
| Ilość gniazd USB 2.0: | 4 | 
| Obsługa przetwarzania równoległego: | Nieobsługiwany | 
| Rodzaj interfejsu sieci Ethernet: | Gigabit Ethernet | 
| Łączna liczba złączy SATA: | 6 | 
| Liczba portów VGA (D-Sub): | 1 | 
| Wersja USB: | 2.0 | 
| Korekcja ECC: | Tak | 
| Ilość portów eSATA: | 6 | 
| Zautomatyzowany system śledzenia klasyfikacji towarów (CCATS): | G135162 | 
| Nowe instrukcje AES (Intel® AES-NI): | Nie | 
| Technologia Intel® Trusted Execution: | Nie | 
| Maksymalna konfiguracja CPU: | 2 | 
| Technologia Wirtualizacji Intel® (Directed I/O) (VT-d): | Nie | 
| Technologia Intel® Clear Video: | Nie | 
| Maksymalna pamięć wewnętrzna wspierana przez procesor: | 192 GB | 
| Przepustowość pamięci obsługiwana przez procesor ( max ): | 1333 GB/s | 
| Pamięć ECC wspierana przez procesor: | Tak | 
| Maksymalna liczba linii PCI Express: | 36 | 
| Termiczny układ zasilania (TDP): | 130 W | 
| Wbudowane opcje dostępne: | Tak | 
| Moduł TPM (Trusted Platform Module): | Nie | 
| Karta graficzna on-board: | Tak | 
| Szeregowe porty komunikacyjne: | 2 | 
| Parytet FSB: | Nie | 
| Technologia Intel® Anti-Theft (Intel® AT): | Nie | 
| Intel® Flex Memory Access: | Nie | 
| Intel® Fast Memory Access: | Nie | 
| Technologia Intel® Dual Display Capable: | Nie | 
| Intel® Rapid Storage Technology: | Nie | 
| Intel® Matrix Storage Technology (Intel® MST): | Nie | 
| Intel HD Audio Technology: | Nie | 
| Intel® Active Management Technology (Intel® AMT): | Nie | 
| Ilość slotów DIMM: | 12 | 
| Ilość portów COM: | 2 | 
| Ilość gniazd SATA: | 6 | 
| Liczba linków QPI: | 3 | 
| PCI Express x8 slots: | 3 | 
| Przepustowość pamięci: | 1333 GB/s | 
| Ilość slotów PCI Express: | 5 | 
| Numer klasyfikacji kontroli eksportu (ECCN): | 5A992C | 
| Kwalifikowalność platformy Intel® vPro ™: | Nie | 
| Obsługa IPMI: | IPMI 2.0 | 
| Gniazda PCI Express x16 (Gen 2.x): | 1 | 
| Segment rynku: | Serwer | 
| PCI Express x8 (Gen 2.x) slots: | 3 | 
| Płyta główna ARK ID: | 36456 | 
| Intel® Advanced Management Technology: | Nie | 
| Opcja SSD wbudowanego portu USB (eUSB): | Nie | 
| Technologia Intel® AC'97: | Nie | 
| Technologia Intel® Client Initiated Remote Access (CIRA): | Nie | 
| Intel® Intel®ligent Power Node Manager: | Tak | 
| Intel® Remote PC Assist Technology (RPAT): | Nie | 
| Intel® Quiet System Technology (QST): | Nie | 
| Intel® Quick Resume Technology: | Nie | 
| Intel® Server Management Software: | Tak | 
| Intel® Quiet Thermal Technology: | Nie | 
| Intel® Efficient Power Technology: | Nie | 
| Intel® Build Assurance Technology: | Nie | 
| Intel® Server Customization Technology: | Nie | 
| Technologia Intel® Remote Wake (Intel® RWT): | Nie | 
| Płyta Rack-Friendly: | Nie | 
| Intel® Remote Management Module Support: | AXXRMM3 | 
| Nazwa produktu: | Intel Server Board S5520UR | 
| Status: | Discontinued | 
| Rodzina produktów: | Płyta do serwera legacy/stacji roboczej | 
| Ostatnia zmiana: | 63903513 | 
| Urodzony: | Q1'09 | 
| Data premiery: | Q1'09 | 
| Seria produktów: | Intel S5000UR | 
| Nazwa kodowa produktu: | Urbanna | 
| URL z dodatkowymi informacjami: | http://www.intel.com/content/www/us/en/motherboards/server-motherboards/server-board-s5520ur.html | 
| Przewidywany termin dyskontynuacji: | Q2'13 | 
| Obsługiwana konfiguracja RAID: | Intel Embedded RAID (0, 1); upgradeable to RAID5 | 
| Intel Node Manager: | Tak | 
| Dostępne systemy zintegrowane: | Tak | 
| Złącze Intel I / O Expansion Module x4 Gen 1: | 1 | 
| Ogłoszenie daty końca życia: | Sunday, June 30, 2013 | 
| Data ostatniego zamówienia: | Tuesday, December 31, 2013 | 
| Data ostatniego potwierdzenia atrybutu: | Wednesday, April 30, 2014 | 
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