Instrukcja obsługi Microchip VSC8502

Microchip nieskategoryzowany VSC8502

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VSC8501, VSC8502

Application Note

VSC8501/VSC8502 Design and Layout Guide

November 2014

VSC8501/VSC8502 Design and Layout Guide

VPPD-03473 VSC8501, VSC8502 Application Note Revision 1.2

Contents

1 Revision History ............................................................................................................................. 1

1.1 Revision 1.2 ........................................................................................................................................

1.2 Revision 1.1 ........................................................................................................................................

1.3 Revision 1.0 ........................................................................................................................................

2 Introduction ................................................................................................................................... 2

2.1 References ..........................................................................................................................................

2.1.1 Vitesse Documents .................................................................................................................................. 2

2.1.2 IEEE Standards ......................................................................................................................................... 2

2.1.3 External Documents ................................................................................................................................ 2

3 Ground Considerations .................................................................................................................. 3

3.1 Exposed Ground Pad ..........................................................................................................................

3.2 Ground Isolation .................................................................................................................................

3.3 Bob Smith Termination ....................................................................................................................... 3

4 Power Considerations .................................................................................................................... 5

4.1 Power Supply Planes ..........................................................................................................................

4.2 Analog Power Plane Filtering .............................................................................................................. 5

4.3 Local Decoupling .................................................................................................................................

4.4 Local Decoupling .................................................................................................................................

5 Package Considerations ................................................................................................................. 7

5.1 Multi-row QFN Breakout Considerations ........................................................................................... 7

5.2 Thermal Considerations ..................................................................................................................... 7

6 Copper Interface ............................................................................................................................ 9

6.1 Layout Considerations ........................................................................................................................

6.2 RJ-45 Connectors ................................................................................................................................

7 MAC Interface .............................................................................................................................. 11

8 RGMII Interface Clock Considerations ......................................................................................... 12

8.1 External Delay Compensation .......................................................................................................... 12

8.2 Internal Delay Compensation ........................................................................................................... 12

9 Miscellaneous Design Considerations .......................................................................................... 14

9.1 REF_FILT/REF_REXT Pins .................................................................................................................. 14

9.2 Clock Inputs ...................................................................................................................................... 1

9.2.1 Clock Power Supply Filtering ................................................................................................................. 14

9.3 LEDs .................................................................................................................................................. 1