Instrukcja obsługi Microchip TC648
Microchip
Niesklasyfikowane
TC648
Przeczytaj poniżej 📖 instrukcję obsługi w języku polskim dla Microchip TC648 (8 stron) w kategorii Niesklasyfikowane. Ta instrukcja była pomocna dla 14 osób i została oceniona przez 7.5 użytkowników na średnio 4.8 gwiazdek
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2003 Microchip Technology Inc. DS91063A-page 1
TB063
INTRODUCTION
Less than six years ago, thermal cooling in the
electronics arena was mainly an issue for high-
performance, high-end applications, such as, military,
aerospace and large-scale industrial and medical
applications. Outside these sectors, thermal cooling
was just a premature notion. In the short span of a few
years, technological and other developments have
made thermal cooling necessary for many applications,
thus requiring the development of a new system
management category: thermal management.
This article discusses an integrated fan speed solution
that provides sophisticated speed control of brushless
DC fans, the most popular type of fan used in electronic
equipment, and helps designers get around problems
like acoustic noise, power consumption, mechanical
wear-out and fault detection.
TRENDS AND DRIVERS
On a board level, many more components need cooling
today than even six months ago; with the CPUs having
begun this trend some years ago. Memory chips never
needed cooling, but now SRAM and DRAM packages
require their own cooling solutions. Video card
processors (mostly the 3D type) and other add-in cards
also require cooling, as will the next generation models.
Hard drives, DVD players, CD players and chipsets are
now candidates for cooling as well. In general, board
speeds are becoming faster and boards are becoming
smaller and more heavily populated. Package
densities are increasing and performing more
functions, thus getting hotter.
New developments in digital chip architecture permit
higher system clock rates and additional on-chip
circuitry, causing the chips to run at higher tempera-
tures. A large portion of the power dissipation is the
capacitive charging and discharging during level transi-
tions. Since the power lost is related to the square of
the supply voltage, the trend to lower voltages reduces
power dissipation.
However, higher losses due to higher switching
speeds, significantly offset these savings. An example
is the 486 microprocessor, which was drawing 12 to 15
watts. As PCs moved into the first Pentium®
generation, the microprocessors started dissipating
25W. Today a Pentium® II dissipates about 40W, and
there have been reports that the forthcoming 64-bit
Merced microprocessor dissipates about 65W.
Thermal cooling is also in demand because of the
explosive growth of new embedded applications.
Telecommunications equipment, printers, household
“smart” appliances, and most importantly, networking
equipment (routers, switches and hubs) are only a few
of the products now driven by embedded CPUs. More
are being added each day, and with the complexity of
multiple functions, thermal cooling has become a
necessity.
WHY DO WE NEED COOLING?
The air immediately surrounding a chip initially cools its
surface. That air eventually warms and rises to the top
of the PC or other equipment’s chassis, where it
encounters more warm air. If not ventilated, this volume
of air becomes warmer and warmer, offering no avenue
of escape for the heat generated by the chips.
Typically, a PC chip designed for commercial use can
withstand up to 125°C – 150°C junction temperature,
although a safety margin of a few degrees might be
specified. Exceeding that limit will either cause the chip
to make errors in its calculations or fail completely. A
chip failure or malfunction impacts the entire system’s
operation. Additional cooling also extends component
life by limiting the maximum temperatures the
components are exposed to. In general, a 10°C
temperature reduction will provide a 2:1 increase in
MTBF (Mean Time Between Failure).
Author: George Paparrizos
Microchip Technology Inc.
An Integrated Fan Speed Control Solution Can Lower
System Costs, Reduce Acoustic Noise, Power Consumption
and Enhance System Reliability
Specyfikacje produktu
| Marka: | Microchip |
| Kategoria: | Niesklasyfikowane |
| Model: | TC648 |
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