Instrukcja obsługi Microchip UXN14M9PE

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UXN14M9P

SMD- Rev E00020

Subject Change Without Noticeto

1 of 10

Features

•Wide Operating Range: DC 14 –

GHz

•Contiguous Divide Ratios: 8 to 511

•Large Output Swings: >1 Vpp/side

•Single-Ended and/or Dierential

Drive

•Size: 6mm x 6mm

•Parallel Control Lines

•Low SSB Phase Noise:

▪147 dBc @ 10 kHz Oset

Description

The UXN14M9P is a highly programma-

ble integer divider covering all integer

divide ratios between 8 and 511.

The device features single-ended

or dierential inputs and outputs.

Parallel control inputs are CMOS

and LVTTL compatible for ease of

system integration. The UXN14M9P

is packaged in a 40-pin, 6mm x 6mm

leadless plastic surface mount package.

Key Specifications (T = 25˚C):

Vee -3.3 = V,Iee = 185 mA, Zo=50 Ω

Application

The UXN14M9P can used beas a general

purpose, highly congurable, divider in

a variety of high frequency synthesizer

applications. Fast switching combined with

a wide range of divide ratios make the

UXN14M9P an excellent choice for fraction-

al-N and integer-N PLLs. Fractional division

may be achieved by applying a sequence to

the divider control lines, such as a delta-

sigma modulated sequence.

Pad Metallization

The QFN package pad metallization consists

of a 300-800 micro-inch (typical thickness 435

micro-inch or 11.04um) 100% matte Sn plate.

The plating covers a Cu (C194) leadframe.

The packages are manufactured

with a >1hr 150C annealing/heat treating

process, and the matte (non-glossy) plating,

specically to mitigate tin whisker growth.

Parameter

Description

Min

Typ

Max

Fin (GHz)

Input Frequency

DC*

-

14

Pin (dBm)

Input Power

-

0

+10

Pout (dBm)

Output Power

-

+4

-

PDC (W)

DC Power Dissipation

-

1.1

-

θjc (ºC/W)

Junction-Case Thermal Resistance

-

14

-

* frequency limit dependent input edge speedLowon

14 GHz Divide-by-8 to 511

Programmable Integer Divider

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