Instrukcja obsługi Microchip VSC8512
Microchip
Niesklasyfikowane
VSC8512
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VSC8512
Application Note
VSC8512 Design Guide

VSC8512 Design Guide
VPPD-01611 VSC8512 Application Note Revision 1.0
Contents
1 Revision History 1.0 ....................................................................................................................... 1
1.1 Revision 1.0 ........................................................................................................................................
2 Introduction ................................................................................................................................... 2
2.1 References .........................................................................................................................................
2.1.1 Vitesse Documents .................................................................................................................................. 2
2.1.2 IEEE Standards ......................................................................................................................................... 2
2.1.3 External Documents ................................................................................................................................ 2
3 Key Item Checklist .......................................................................................................................... 3
4 Design Aids ..................................................................................................................................... 4
4.1 Reference Design ................................................................................................................................
4.2 IBIS Model ..........................................................................................................................................
4.3 BSDL File .............................................................................................................................................
4.4 OrCAD Symbol ....................................................................................................................................
5 Copper Magnetics Modules ........................................................................................................... 5
5.1 Return Loss Parameter ....................................................................................................................... 5
5.2 Secondary Magnetics Parameters ...................................................................................................... 5
6 EMI Management .......................................................................................................................... 6
6.1 PHY EMI testing ..................................................................................................................................
6.2 MAC Interface Design Keys .................................................................................................................
6.3 Copper Interface Design Keys .............................................................................................................
6.4 Grounding Considerations ..................................................................................................................
6.4.1 Ground Isolation ...................................................................................................................................... 6
6.5 Bob Smith Termination .......................................................................................................................
7 Power Supply Considerations ........................................................................................................ 9
7.1 Power Supply Planes ..........................................................................................................................
7.2 Analog Power Plane Filtering .............................................................................................................. 9
7.3 Local Decoupling .................................................................................................................................
7.4 Power Supply and Clock Sequencing ................................................................................................ 10
7.5 Power Supply Estimated Requirements ........................................................................................... 10
8 Thermal Considerations ............................................................................................................... 11
8.1 Heat Removal from Device ............................................................................................................... 11
8.2 Temperature Measurement ............................................................................................................. 12
8.2.1 Temperature Diode Options ................................................................................................................. 12
9 Copper Interface .......................................................................................................................... 13
9.1 Layout Considerations ...................................................................................................................... 13

VSC8512 Design Guide
VPPD-01611 VSC8512 Application Note Revision 1.0
9.2 Using PHYs in Backplane Applications .............................................................................................. 13
9.3 Surge Protection ............................................................................................................................... 14
9.4 PHY Miscellaneous ........................................................................................................................... 14
10 MAC Interfaces ........................................................................................................................... 15
10.1 QSGMII Interface ............................................................................................................................ 1
10.2 SGMII/SerDes Interface .................................................................................................................. 15
10.3 Design Rules ................................................................................................................................... 1
10.4 AC Coupling Capacitors .................................................................................................................. 16
10.5 SerDes Media ................................................................................................................................. 1
10.5.1 Unidirectional for Streaming ............................................................................................................... 16
11 Miscellaneous Design Considerations ........................................................................................ 17
11.1 SMI (MDC/MDIO) Device Address .................................................................................................. 17
11.2 REF_FILT / REF_REXT Pins ............................................................................................................... 17
11.3 Device Clock Input .......................................................................................................................... 1
11.3.1 Clock Power Supply Filtering ............................................................................................................... 18
11.4 COMA_MODE ................................................................................................................................. 1
11.5 CLKOUT Pin ..................................................................................................................................... 1
11.6 Serial Management Interface (SMI) ............................................................................................... 18
11.7 JTAG (Boundary Scan) Design ......................................................................................................... 19
11.7.1 JTAG Interface “Never” Used .............................................................................................................. 19
11.7.2 JTAG Interface Used In Board Design .................................................................................................. 19
11.7.3 AC-JTAG ............................................................................................................................................... 19
11.8 LEDs ................................................................................................................................................ 1
11.8.1 Dual LED per Port Option .................................................................................................................... 20
11.8.2 Serial LED Option ................................................................................................................................. 20
11.8.3 Adjustable Brightness LED ................................................................................................................... 20
11.9 GPIO and Multi Mode Pins ............................................................................................................. 20
11.9.1 Fast Link Failure ................................................................................................................................... 20
11.10 CMODE Interface .......................................................................................................................... 20
11.11 SyncE Support ............................................................................................................................... 20
11.12 Controlling SFPs and Talking to I2C Devices ................................................................................. 20
11.13 Unused PHY Ports ......................................................................................................................... 2
12 Software Considerations ............................................................................................................. 22
12.1 Resources ....................................................................................................................................... 2
12.2 Configuration .................................................................................................................................. 2
12.3 Minimum Register Configuration ................................................................................................... 22
12.4 Power Management Software Features ......................................................................................... 22
12.4.1 EEE ....................................................................................................................................................... 22
12.4.2 ActiPHY ................................................................................................................................................ 22
12.4.3 PerfectReach ....................................................................................................................................... 22
Specyfikacje produktu
Marka: | Microchip |
Kategoria: | Niesklasyfikowane |
Model: | VSC8512 |
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