Instrukcja obsługi Texas Instruments CD74HCT367E
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CD74HCT367E
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CDx4HC367, CDx4HC368, CDx4HCT367, CD74HCT368 High-Speed CMOS Logic Hex
Buffer/Line Driver, Three-State Non-Inverting and Inverting
1 Features
• Buffered inputs
• High current bus driver outputs
• Two independent three-state enable controls
• Typical propagation delay tPLH, tPHL = 8 ns
at VCC = 5 V, CL =15 pF, TA = 25℃
• Fanout (over temperature range)
– Standard outputs: 10 LSTTL Loads
– Bus driver outputs: 15 LSTTL Loads
• Wide operating temperature range: -55 to 125℃ ℃
• Balanced propagation delay and transition times
• Significant power reduction compared to LSTTL
Logic ICs
• HC Types
– 2 V to 6 V operation
– High noise immunity: NIL = 30%,
NIH = 30% of VCC at VCC = 5 V
• HCT Types
– 4.5 V to 5.5 V operation
– Direct LSTTL input logic compatibility,
VIL = 0.8 V (Max), VIH = 2 V (Min)
– CMOS input compatibility, II ≤ 1 μA at VOL, VOH
2 Description
The ’HC367, ’HCT367, ’HC368, and CD74HCT368
silicon gate CMOS three-state buffers are general
purpose high-speed non-inverting and inverting
buffers. The ’HC367 and ’HCT367 are non-inverting
buffers, whereas the ’HC368 and CD74HCT368 are
inverting buffers. They have high drive current outputs
which enable high speed operation even when driving
large bus capacitances. These circuits possess the
low power dissipation of CMOS circuitry, yet have
speeds comparable to low power Schottky TTL
circuits. Both circuits are capable of driving up to 15
low power Schottky inputs.
Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
CD74HC367M SOIC (16) 9.90 mm × 3.90 mm
CD74HC368M SOIC (16) 9.90 mm × 3.90 mm
CD74HCT367M SOIC (16) 9.90 mm × 3.90 mm
CD74HCT368M SOIC (16) 9.90 mm × 3.90 mm
CD74HC367E PDIP (16) 19.31 mm × 6.35 mm
CD74HC368E PDIP (16) 19.31 mm × 6.35 mm
CD74HCT367E PDIP (16) 19.31 mm × 6.35 mm
CD74HCT368E PDIP (16) 19.31 mm × 6.35 mm
CD54HC367F3A CDIP (16) 24.38 mm × 6.92 mm
CD54HC368F3A CDIP (16) 24.38 mm × 6.92 mm
CD54HCT367F3A CDIP (16) 24.38 mm × 6.92 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
1OE 1
1A1 21Y1
3
2OE 15
2A1 12 2Y1
11
1A2 41Y2
5
1A3 61Y3
7
1A4
9
1Y4
10
2A2 14 2Y2
13
Functional Block Diagram
CD54HC367, CD74HC367, CD54HCT367
CD74HCT367, CD54HC368, CD74HC368, CD74HCT368
SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

Table of Contents
1 Features............................................................................1
2 Description.......................................................................1
3 Revision History.............................................................. 2
4 Pin Configuration and Functions...................................3
5 Specifications.................................................................. 4
5.1 Absolute Maximum Ratings........................................ 4
5.2 Recommended Operating Conditions.........................4
5.3 Thermal Information....................................................4
5.4 Electrical Characteristics.............................................5
5.5 Switching Characteristics............................................6
6 Parameter Measurement Information............................ 7
7 Detailed Description........................................................8
7.1 Overview.....................................................................8
7.2 Functional Block Diagram........................................... 8
7.3 Device Functional Modes............................................8
8 Power Supply Recommendations..................................9
9 Layout...............................................................................9
9.1 Layout Guidelines....................................................... 9
10 Device and Documentation Support..........................10
10.1 Receiving Notification of Documentation Updates..10
10.2 Support Resources................................................. 10
10.3 Trademarks............................................................. 10
10.4 Electrostatic Discharge Caution..............................10
10.5 Glossary..................................................................10
11 Mechanical, Packaging, and Orderable
Information.................................................................... 10
3 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2003) to Revision E (February 2022) Page
• Updated the numbering, formatting, tables, figures, and cross-references throughout the document to reflect
modern data sheet standards.............................................................................................................................1
CD54HC367, CD74HC367, CD54HCT367
CD74HCT367, CD54HC368, CD74HC368, CD74HCT368
SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022 www.ti.com
2Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: CD54HC367 CD74HC367 CD54HCT367 CD74HCT367 CD54HC368 CD74HC368
CD74HCT368

4 Pin Configuration and Functions
'HC367, 'HCT367
J, D, or N package
16-Pin CDIP, SOIC, PDIP
Top View
'HC368, CD74HCT368
J, D, or N package
16-Pin CDIP, SOIC, PDIP
Top View
www.ti.com
CD54HC367, CD74HC367, CD54HCT367
CD74HCT367, CD54HC368, CD74HC368, CD74HCT368
SCHS181E – NOVEMBER 1997 – REVISED FEBRUARY 2022
Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3
Product Folder Links: CD54HC367 CD74HC367 CD54HCT367 CD74HCT367 CD54HC368 CD74HC368
CD74HCT368
Specyfikacje produktu
Marka: | Texas Instruments |
Kategoria: | Niesklasyfikowane |
Model: | CD74HCT367E |
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