Instrukcja obsลugi Texas Instruments SN74LVTH16501DL
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SN74LVTH16501DL
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SCBS700F โ JULY 1997 โ REVISED AUGUST 2009
1
POST OFFICE BOX 655303 โข DALLAS, TEXAS 75265
DMembers of the Texas Instruments
Widebus๏ฃช Family
DUBT ๏ฃช Transceiver Combines D-Type
Latches and D-Type Flip-Flops for
Operation in Transparent, Latched, or
Clocked Mode
DState-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low Static-Power
Dissipation
DSupport Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC)
DSupport Unregulated Battery Operation
Down to 2.7 V
DTypical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25ยฐC
DIoff and Power-Up 3-State Support Hot
Insertion
DBus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
DDistributed VCC and GND Pins Minimize
High-Speed Switching Noise
DFlow-Through Architecture Optimizes PCB
Layout
DLatch-Up Performance Exceeds 500 mA Per
JESD 17
DESD Protection Exceeds JESD 22
โ 2000-V Human-Body Model (A114-A)
โ 200-V Machine Model (A115-A)
description/ordering information
The โLVTH16501 devices are 18-bit universal bus transceivers designed for low-voltage (3.3-V) V CC operation,
but with the capability to provide a TTL interface to a 5-V system environment.
ORDERING INFORMATION
TAPACKAGEโ ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SSOP DL
Tube SN74LVTH16501DL
LVTH16501
โ40ยฐ ยฐC to 85 C SSOP โ DL Tape and reel SN74LVTH16501DLR LVTH16501
40 CC to 85
TSSOP โ DGG Tape and reel SN74LVTH16501DGGR LVTH16501
โ55ยฐ ยฐC to 125 C Tube SNJ54LVTH16501WD SNJ54LVTH16501WDCFP โ WD
โ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
Copyright ๏ฃฉ 2002, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and UBT are trademarks of Texas Instruments.
SN54LVTH16501 . . . WD PACKAGE
SN74LVTH16501 . . . DGG OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
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7
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13
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15
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28
56
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45
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OEAB
LEAB
A1
GND
A2
A3
VCC
A4
A5
A6
GND
A7
A8
A9
A10
A11
A12
GND
A13
A14
A15
VCC
A16
A17
GND
A18
OEBA
LEBA
GND
CLKAB
B1
GND
B2
B3
VCC
B4
B5
B6
GND
B7
B8
B9
B10
B11
B12
GND
B13
B14
B15
VCC
B16
B17
GND
B18
CLKBA
GND
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SCBS700F โ JULY 1997 โ REVISED AUGUST 2009
2POST OFFICE BOX 655303 โข DALLAS, TEXAS 75265
description/ordering information (continued)
Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA),
and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when
LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is
low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the
outputs are active. When OEAB is low, the outputs are in the high-impedance state.
Data ๎ow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are
complementary (OEAB is active high and OEBA is active low).
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor
and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by
the current-sinking/current-sourcing capability of the driver.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
FUNCTION TABLEโ
INPUTS
OUTPUT
OEAB LEAB CLKAB A
OUTPUT
B
L X X X Z
H H X L L
H H X H H
H L โL L
H L โH H
H L H X B0โก
H L L X B0ยง
โ A-to-B data ๎ow is shown; B-to-A ๎ow is similar, but
uses OEBA, LEBA, and CLKBA.
โกOutput level before the indicated steady-state input
conditions were established, provided that CLKAB
was high before LEAB went low
ยงOutput level before the indicated steady-state input
conditions were established

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SCBS700F โ JULY 1997 โ REVISED AUGUST 2009
3
POST OFFICE BOX 655303 โข DALLAS, TEXAS 75265
logic diagram (positive logic)
1D
C1
CLK
1D
C1
CLK
B1
OEAB
CLKAB
LEAB
LEBA
CLKBA
OEBA
A1
1
55
2
28
30
27
354
To 17 Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted) โ
Supply voltage range, VCC โ0.5 V to 4.6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) โ0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) โ0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state, V O (see Note 1) โ0.5 V to VCC + 0.5 V. . . . . . . . . . . . .
Current into any output in the low state, IO: SN54LVTH16501 96 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74LVTH16501 128 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the high state, IO (see Note 2): SN54LVTH16501 48 mA. . . . . . . . . . . . . . . . . . . . .
SN74LVTH16501 64 mA. . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) โ50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0) โ50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, ฮธJA (see Note 3): DGG package 64ยฐC/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package 56ยฐC/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg โ65ยฐ ยฐC to 150 C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
โ Stresses beyond those listed under โabsolute maximum ratingsโ may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under โrecommended operating conditionsโ is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This current flows only when the output is in the high state and V
O > VCC.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
Specyfikacje produktu
Marka: | Texas Instruments |
Kategoria: | Niesklasyfikowane |
Model: | SN74LVTH16501DL |
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